Laser PCB Depaneling Applications:

FPC and PCB separator equipment includes laser depaneling, PCB punching, milling cutter PCB depanelizer, and other mechanical equipment. Laser PCB depanelizer is a special board separator for FPC flexible circuit board and PCB rigid circuit board industry by using high-power ultraviolet laser.

The laser PCB depanelizer can cut any shape without changing any props and clamps, and without steel mesh. The same equipment can meet the requirements of special-shaped and linear cutting, and is easy to realize automatic production line with high flexibility.

The laser PCB depaneling machine can process the materials around the circuit board, such as PCB, FPC, film coating, pet, reinforcing plate, IC, ultra-thin metal cutting, etc. It is practical and compatible with various materials processing. It is easy to operate and import drawings without adjusting any mechanical parts. Improve production efficiency, save production process and production cycle. In particular, it can quickly and efficiently meet the needs of rapid proofing, and directly import drawings for cutting and positioning.

The traditional processing method generally has V-shaped groove, which will cause certain damage to the boards in the production process. The laser depaneling can directly cut the bare plate without V-groove. In addition, the traditional processing method is to directly use tools to process the circuit board, especially the stamping method has a great impact on the circuit board, which is easy to cause the deformation of the circuit board. The laser PCB depaneling machine is a non-contact processing method. It acts on the surface of materials through high-energy beams, which will not cause stress effects, nor will it cause deformation and damage to the circuit board.