PCB Depaneling Machine Development

PCB depaneling is an important process in the mass electronic assembly production process. In order to improve the output of printed circuit board (PCB) manufacturing and surface mount (SMT) line speed, the printed circuit board is usually designed as a large board, and the PCB depaneling machine will be used in the final product to divide into many smaller single PCB small boards. This large PCB board can be called a connecting board or a panel. This large connecting board is separated into small pieces in different product processes, which may be divided after SMT, after ICT, after welding through-hole SMT, or before final product assembly.

PCB depaneling machine is a kind of machine used in the process of continuous cutting of PCB. While the quality of traditional manual folding is uncontrollable, there are also hidden dangers in the work safety of folding personnel. However, due to the uneven force of manual folding and the difference of angle and position of folding, the PCB electrical circuit, parts and tin tracks are damaged, components fall off, copper foil deformation and plate fall off, and other short life and adverse phenomena.

Compared with the quality problem of traditional manual folding, the appearance of PCB laser cutting machine makes up for this shortcoming. The advantages of PCB laser cutting machine are obvious. The PCB laser cutting machine has high work efficiency in production. The PCB cutting machine is very safe when working. Any enterprise should pay attention to the production safety of products in addition to the quality of products, This process has been mandatory by European and American customers as early as 2004.

The principle of PCB laser depaneling machine is to irradiate the surface of PCB circuit board with high-energy beam, and realize the vaporization cutting of PCB materials by controlling the beam energy density, frequency, speed, processing times and other parameters.

Some friends can not help but wonder whether such a high-temperature processing method will cause the surface of PCB materials to melt and blacken. The answer is yes and No. In the early days, CO2 laser was used for PCB laser cutting. The light spot of this light source was thick and the thermal effect was large. Some PCB materials did not absorb the laser with a wavelength of 10.6 μ m well, and it was easy to be burnt. With the continuous improvement of laser technology and the continuous increase of green light and ultraviolet laser power, it has been introduced into the PCB circuit board cutting industry and has been fully applied.

The precision laser PCB depaneling machine SMTL300 adopts non-contact laser processing, and will not produce any mechanical stress and deformation. It can process any complex graphics and shorten the delivery period; High performance image positioning system to meet the needs of high-precision processing; The cutting heat effect area is small, and the processing yield is improved; Cutting burr free black edge curling, no secondary processing, suitable for laser cutting of FPC reinforcing plate, rigid PCB, PI film, LCP and other materials.