Typical Depaneling Methods

1. PUNCHING/DIE CUTTING

This process requires a different die for each new circuit board. The punching fixture has sharp blades on one part and supports on the other.

It also uses either a shearing or crushing method, which can deform the board. Sharp die edges are imperative to minimize damage.

2. V SCORING

Board thickness is reduced by boards being scored along the cut line on both sides. Both sides of the panel are scored to a depth of about 30% of the board’s thickness. PCBs are then broken out of the panel.

3. WHEEL CUTTING / PIZZA CUTTER

This is a manual alternative to breaking the web after V-scoring to cut the remaining web. This method requires careful alignment between the V-score and the cutter wheels to reduce stress to some components.

4. SAWING

A single routing saw blade is typically used to cut the panel from either the top or the bottom.

5. ROUTING

Most PCBs are routed, which leaves the individual circuits connected to the panel frame by narrow tabs. The tabs are broken or snapped to singulate the circuits.

6. LASER DEPANELING

No mechanical dies or blades are needed for this method, which is completely software-controlled.

Any shape path, including curves and sharp corners, can be completed with this method, which also provides an unparalleled space advantage.